JPH01118438U - - Google Patents

Info

Publication number
JPH01118438U
JPH01118438U JP1264188U JP1264188U JPH01118438U JP H01118438 U JPH01118438 U JP H01118438U JP 1264188 U JP1264188 U JP 1264188U JP 1264188 U JP1264188 U JP 1264188U JP H01118438 U JPH01118438 U JP H01118438U
Authority
JP
Japan
Prior art keywords
electronic component
wire
guide
cut
frame member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1264188U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1264188U priority Critical patent/JPH01118438U/ja
Publication of JPH01118438U publication Critical patent/JPH01118438U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP1264188U 1988-02-02 1988-02-02 Pending JPH01118438U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1264188U JPH01118438U (en]) 1988-02-02 1988-02-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1264188U JPH01118438U (en]) 1988-02-02 1988-02-02

Publications (1)

Publication Number Publication Date
JPH01118438U true JPH01118438U (en]) 1989-08-10

Family

ID=31222258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1264188U Pending JPH01118438U (en]) 1988-02-02 1988-02-02

Country Status (1)

Country Link
JP (1) JPH01118438U (en])

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